IEEE - Institute of Electrical and Electronics Engineers, Inc. - Viking SuperSPARC AMCM development program

Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)

Author(s): Eichelberger, C.W. ; Davidson, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 15 May 1993
Page(s): 29 - 32
ISBN (Paper): 0-8186-3540-1
DOI: 10.1109/MCMC.1993.302157
Regular:

A program to develop a Viking SuperSparc AMCM is discussed. The program is structured not only to provide a prototype module, but also to resolve key infrastructure issues associated with volume... View More

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