IEEE - Institute of Electrical and Electronics Engineers, Inc. - Developing a merchant MCM infrastructure

Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)

Author(s): Naclerio, N.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 15 May 1993
ISBN (Paper): 0-8186-3540-1
DOI: 10.1109/MCMC.1993.302154
Regular:

Summary form only given. Despite demand for higher performance, miniaturization, and more cost-effective subsystem packaging, potential users of MCM technology have been frustrated by long lead... View More

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