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Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)

Author(s): Forman, G.A. ; Becker, C.A. ; Eskew, M. ; Huegel, R. ; Smith, D. ; Jordan, R.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 15 May 1993
Page(s): 52 - 57
ISBN (Paper): 0-8186-3540-1
DOI: 10.1109/MCMC.1993.302152
Regular:

The authors point out that the GE high density interconnect multichip module (HDI MCM) process has been broadly applied to many types of advanced system architectures, and recently the CAD... View More

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