IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of the RIT infrastructure for design, fabrication and testing of small multichip modules

Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)

Author(s): Mukund, P.R. ; Pearson, R.E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 15 May 1993
Page(s): 58 - 60
ISBN (Paper): 0-8186-3540-1
DOI: 10.1109/MCMC.1993.302151
Regular:

The infrastructural work in progress at the Rochester Institute of Technology in the area of the multichip modules is described. Facilities for design, fabrication and testing are being developed.... View More

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