IEEE - Institute of Electrical and Electronics Engineers, Inc. - The pretreatment of aluminum bondpads for electroless nickel bumping

Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)

Author(s): Ostmann, A. ; Simon, J. ; Reichl, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Santa Cruz, CA, USA, USA
Conference Date: 15 May 1993
Page(s): 74 - 78
ISBN (Paper): 0-8186-3540-1
DOI: 10.1109/MCMC.1993.302148
Regular:

Electroless nickel bumping is a low cost approach to bumping. This method can also be used to convert the aluminum bondpad to a solderable surface (Ni/Au) for flip-chip application. In this study,... View More

Advertisement