IEEE - Institute of Electrical and Electronics Engineers, Inc. - Designing interconnection networks for multi-level packaging

SUPERCOMPUTING '93

Author(s): Raghunath, M.T. ; Ranade, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Portland, OR, USA
Conference Date: 19 November 1993
Page(s): 772 - 781
ISBN (Paper): 0-8186-4340-4
ISSN (Paper): 1063-9535
DOI: 10.1109/SUPERC.1993.1263535
Regular:

A central problem in building large scale parallel machines is the design of the interconnection network. Interconnection network design is largely constrained by packaging technology. The authors... View More

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