IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of side wall grooves and metallization thickness on the dispersion characteristics of finline structure

Author(s): Ouadi, A ; Bourdoucen, H
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 1993
Conference Location: Madrid, Spain, Spain
Conference Date: 6 September 1993
Page(s): 684
DOI: 10.1109/EUMA.1993.336670
Regular:

In this investigation, the hybrid-mode solution for shielded finline/strip configuration on an anisotropic substrate, is presented through an improved analysis. In particular, the metallization... View More

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