IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability technology to achieve insertion of advanced packaging (RELTECH) program

Proceedings of NAECON '93 - National Aerospace and Electronics Conference

Author(s): Fayette, D.F. ; Speicher, P. ; Stoklosa, M. ; Evans, J. ; Evans, J. ; Gentile, M. ; Hakim, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Dayton, OH, USA
Conference Date: 24 May 1993
ISBN (Paper): 0-7803-1295-3
DOI: 10.1109/NAECON.1993.290919
Regular:

This paper describes a joint military/commercial effort to evaluate MCM structures and represents a model for future reliability studies for other technologies. The first MCM technology evaluated... View More

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