IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal-structural reliability assessment of helix TWT interaction circuit using finite element analysis

Proceedings of NAECON '93 - National Aerospace and Electronics Conference

Author(s): Rocci, P.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Dayton, OH, USA
Conference Date: 24 May 1993
ISBN (Paper): 0-7803-1295-3
DOI: 10.1109/NAECON.1993.290849
Regular:

Finite element analysis (FEA) techniques were used to assess the mechanical performance due to thermal loading of a high power, wide band, helix traveling wave tube's interaction (slow wave)... View More

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