IEEE - Institute of Electrical and Electronics Engineers, Inc. - Computer-aided design on the VLSI 45/spl deg/-mask compaction

Proceedings of TENCON '93. IEEE Region 10 International Conference on Computers, Communications and Automation

Author(s): W.S. Feng ; W.T. Yang ; M.Y. Hsieh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Beijing, China, China
Conference Date: 19 October 1993
Volume: 2
Page Count: 4
ISBN (Paper): 0-7803-1233-3
DOI: 10.1109/TENCON.1993.320078
Regular:

We combine 1D compaction with reshaping-a new action to improve the result of the compaction. Our algorithms change layout element shapes automatically according to some criteria and make... View More

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