IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of thin-reliable multichip modules

Proceedings of 1993 10th Biennial University/Government/ Industry Microelectronics Symposium

Author(s): Hess, G.T. ; Sanders, T.J. ; Miller, R. ; Gsteiger, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Research Triangle Park, NC, USA
Conference Date: 18 May 1993
Page(s): 56 - 58
ISBN (Paper): 0-7803-0990-1
ISSN (Paper): 0749-6877
DOI: 10.1109/UGIM.1993.297037
Regular:

The fabrication of thin, reliable multichip modules has been demonstrated by Florida Institute of Technology. This involved developing encapsulation techniques to build multichip modules (MCMs)... View More

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