IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of electrical packages via simulation and measurement

Proceedings of 1993 10th Biennial University/Government/ Industry Microelectronics Symposium

Author(s): Luk, T. ; Hosseini, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1993
Conference Location: Research Triangle Park, NC, USA
Conference Date: 18 May 1993
Page(s): 162 - 165
ISBN (Paper): 0-7803-0990-1
ISSN (Paper): 0749-6877
DOI: 10.1109/UGIM.1993.297015
Regular:

A methodology that makes use of the advantages of both electromagnetic simulation and measurement to characterize integrated circuit packages is presented. The advantages, limitations and... View More

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