IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal assembly of polysilicon microstructures

Author(s): Fedder, G.K. ; Howe, R.T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1991
Conference Location: Nara, Japan
Conference Date: 30 January 1991
Page(s): 63 - 68
ISBN (Paper): 0-87942-641-1
DOI: 10.1109/MEMSYS.1991.114770
Regular:

Thermal microassembly techniques are demonstrated which extend the capabilities of surface micromachining technology. Bridges are cleanly severed by application of a single 30 mA, 100 mu s pulse.... View More

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