IEEE - Institute of Electrical and Electronics Engineers, Inc. - Automated inspection of solder joints on PC boards by supplementary processing of 3D and gray-level images

Author(s): Mengel, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1990
Conference Location: Pacific Grove, CA, USA
Conference Date: 27 November 1990
ISBN (Paper): 0-87942-600-4
DOI: 10.1109/IECON.1990.149240
Regular:

High-resolution, 3-D detection of the surface coordinates of printed circuit boards using optical 3-D sensors, combined with an available intensity image, offers a reliable way of judging the... View More

Advertisement