IEEE - Institute of Electrical and Electronics Engineers, Inc. - A fast testing of electromigration immunity using noise measurement technique

Author(s): Komori, J. ; Takata, Y. ; Mitsuhashi, J. ; Tsubouchi, N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1990
Conference Location: Kyoto, Japan
Conference Date: 18 March 1990
Page(s): 257 - 261
ISBN (Paper): 0-87942-588-1
DOI: 10.1109/ICMTS.1990.161753
Regular:

A quick wafer-level evaluation technique for electromigration immunity is proposed. Noise measurements (1/f, 1/f/sup 2/) are performed on a test pattern with stress gradients under high current... View More

Advertisement