IEEE - Institute of Electrical and Electronics Engineers, Inc. - Test chip for the evaluation of surface-diffusion phenomena in sputtered aluminum planarization processes

Author(s): Jones, M.A. ; Roberts, J.A. ; Ellenwood, C.H. ; Cresswell, M.W. ; Allen, R.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1990
Conference Location: Kyoto, Japan
Conference Date: 18 March 1990
Page(s): 35 - 40
ISBN (Paper): 0-87942-588-1
DOI: 10.1109/ICMTS.1990.161709
Regular:

A test chip has been designed and fabricated for the evaluation of surface-diffusion phenomena. It allows the confirmation of the correct sample cross-section bevel angle and orientation for... View More

Advertisement