IEEE - Institute of Electrical and Electronics Engineers, Inc. - An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias

Author(s): Xiaole Cui ; Xiaoxin Cui ; Yewen Ni ; Min Miao ; Jin Yufeng
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1 - 10
ISSN (Paper): 1063-8210
ISSN (Online): 1557-9999
DOI: 10.1109/TVLSI.2017.2651141
Regular:

Through silicon vias (TSVs) play an important role as the vertical electrical connections in 3-D stacked integrated circuits. However, the closely clustered TSVs suffer from the crosstalk noise... View More

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