IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability of Ag Sintering for Power Semiconductor Die Attach in High Temperature Applications

Author(s): Fang Yu ; Jinzi Cui ; Zhangming Zhou ; Kun Fang ; R. Wayne Johnson ; Michael C. Hamilton
Sponsor(s): IEEE Power Electronics Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Paper): 0885-8993
ISSN (Online): 1941-0107
DOI: 10.1109/TPEL.2016.2631128
Regular:

Low temperature Ag sintering provides a lead-free die attachment method that is compatible with high temperature (300°C) power electronics applications. The reliability of sintered Ag die attach... View More

Advertisement