IEEE - Institute of Electrical and Electronics Engineers, Inc. - Stochastic Buffering For Bundled SWCNT Interconnects Considering Unidimensional Fabrication Variation

Author(s): Lin Liu ; yuchen zhou ; Shiyan Hu
Sponsor(s): IEEE Computer Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Online): 2168-6750
DOI: 10.1109/TETC.2017.2683447
Regular:

The heterogeneous system architecture which leverages multicore computing paradigm has become increasingly popular. Nevertheless, timing minimization is still a critical design challenge. Buffer... View More

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