IEEE - Institute of Electrical and Electronics Engineers, Inc. - Built-In Test and Diagnosis for TSVs with Different Placement Topologies and Crosstalk Impact Ranges

Author(s): Wen-Hsuan Hsu ; Michael A. Kochte ; Kuen-Jong Lee
Sponsor(s): IEEE Council on Electronic Design Automation
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Volume: PP
Page(s): 1
ISSN (Paper): 0278-0070
ISSN (Online): 1937-4151
DOI: 10.1109/TCAD.2016.2613928
Regular:

Through Silicon Vias (TSVs) play an important role in 3D chip integration. By providing vertical interconnection, routing area can be decreased and bandwidth can be increased. Effective and... View More

Advertisement