Tsinghua University Press Ltd. - Damage of Interconnects by Electromigration Induced Surface Evolution

Author(s): Zhao Zhijun ; Yang Wei
Publisher: Tsinghua University Press Ltd.
Publication Date: 1 June 1997
Volume: 2
Page(s): 574 - 577
ISSN (Electronic): 1007-0214
Regular:

Under intensive electric current, exposed aluminum interconnects undergo surface evolution driven by electromigration. The evolution of the surface morphology induces fluctuations in electric... View More

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