IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low-Temperature, Solution-Processed, 3-D Complementary Organic FETs on Flexible Substrate

Author(s): Sujeong Kyung ; Jimin Kwon ; Yun-Hi Kim ; Sungjune Jung
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2017
Volume: 64
Page(s): 1,955 - 1,959
ISSN (Paper): 0018-9383
ISSN (Online): 1557-9646
DOI: 10.1109/TED.2017.2659741
Regular:

Vertical stacking of thin-film transistors is an effective way to reduce the footprint of a device, thus increases transistor density in complex flexible electronic applications without reducing... View More

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