IEEE - Institute of Electrical and Electronics Engineers, Inc. - An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Author(s): Yu-Chen Hu ; Yu-Chieh Huang ; Po-Tsang Huang ; Shang-Lin Wu ; Hsiao-Chun Chang ; Yu-Tao Yang ; Yan-Huei You ; Jr-Ming Chen ; Yan-Yu Huang ; Yen-Han Lin ; Jeng-Ren Duann ; Tzai-Wen Chiu ; Wei Hwang ; Ching-Te Chuang ; Jin-Chern Chiou ; Kuan-Neng Chen
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2017
Volume: 64
Page(s): 1,666 - 1,673
ISSN (Paper): 0018-9383
ISSN (Online): 1557-9646
DOI: 10.1109/TED.2017.2660763
Regular:

In the traditional neural sensing microstructure, the limited metal line pitch and the metal layer numbers restrict the neural signal routing ability from electrodes to circuit chips. Miniature... View More

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