IEEE - Institute of Electrical and Electronics Engineers, Inc. - Next Generation IGBT and Package Technologies for High Voltage Applications

Author(s): Arnost Kopta ; Munaf Rahimo ; Chiara Corvasce ; Maxi Andenna ; Franc Dugal ; Fabian Fischer ; Samuel Hartmann ; Andreas Baschnagel
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2017
Volume: 64
Page(s): 753 - 759
ISSN (Paper): 0018-9383
ISSN (Online): 1557-9646
DOI: 10.1109/TED.2017.2655485
Regular:

In this paper, we will present an overview of the latest results covering both Insulated Gate Bipolar Transistor (IGBT) and packaging technologies intended for demanding high-power applications.... View More

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