IEEE - Institute of Electrical and Electronics Engineers, Inc. - Parallel Plate Mode Suppression in Low-Frequency Microwave Circuit Packages Using Lid of 3-D Cross by a 3-D Printing Technique

Author(s): Yongrong Shi ; Ming Zhou ; Junzhi Zhang
Sponsor(s): IEEE Electromagnetic Compatibility Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2017
Volume: 59
Page(s): 1,268 - 1,271
ISSN (Electronic): 1558-187X
ISSN (Paper): 0018-9375
DOI: 10.1109/TEMC.2016.2638884
Regular:

A novel lid of three-dimensional (3-D) cross is proposed for parallel plate mode suppression in low-frequency microstrip circuit packages. The dispersion analysis of the unit cell of the periodic... View More

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