IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advances in Modeling, Measurement and Design of Discontinuities and Their EMC and SI/PI Effects on Wired Communication Links
|Sponsor(s):||IEEE Electromagnetic Compatibility Society|
|Publisher:||IEEE - Institute of Electrical and Electronics Engineers, Inc.|
|Publication Date:||1 June 2017|
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.