IEEE - Institute of Electrical and Electronics Engineers, Inc. - Advances in Modeling, Measurement and Design of Discontinuities and Their EMC and SI/PI Effects on Wired Communication Links

Sponsor(s): IEEE Electromagnetic Compatibility Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2017
Volume: 59
Page Count: 1
Page(s): 1,001
ISSN (Paper): 0018-9375
ISSN (Online): 1558-187X
DOI: 10.1109/TEMC.2016.2601452
Regular:

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.

Advertisement