IEEE - Institute of Electrical and Electronics Engineers, Inc. - In Situ Platform for Isothermal Testing of Thin-Film Mechanical Properties Using Thermal Actuators

Author(s): Mohamed E. Saleh ; Jack L. Beuth ; Yoosuf N. Picard ; Maarten P. de Boer
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2015
Volume: 24
Page(s): 2,008 - 2,018
ISSN (Paper): 1057-7157
ISSN (Online): 1941-0158
DOI: 10.1109/JMEMS.2015.2459695
Regular:

An in situ tensile test platform has been developed to study the mechanical properties of thin-film metal specimens. The fully integrated on-chip platform loads a specimen using a thermal actuator... View More

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