IEEE - Institute of Electrical and Electronics Engineers, Inc. - Lead-Free Flip-Chip Packaging Affects on Ultralow- $k$ Chip Delamination

Author(s): Kuo Ming Chen ; Yunn Horng Guu ; Tsung Shu Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2012
Volume: 2
Page Count: 7
Page(s): 1,985 - 1,991
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2193880
Regular:

Ultralow-k dielectric materials generally show weak mechanical strength (E <; 8 GPa), a high coefficient of thermal expansion (5 ppm/°C-8 ppm/°C), and poor adhesion ( <; 5 J/m2-10... View More

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