IEEE - Institute of Electrical and Electronics Engineers, Inc. - Sintering of Silver–Aluminum Nanopaste With Varying Aluminum Weight Percent for Use as a High-Temperature Die-Attach Material

Author(s): V. R. Manikam ; K. A. Razak ; Kuan Yew Cheong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2012
Volume: 2
Page Count: 9
Page(s): 1,940 - 1,948
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2209425
Regular:

A new Ag-Al nanopaste die-attach system for high-temperature use is introduced for the first time in this paper. The Ag-Al nanopaste with varying Al nanoparticle weight percent (wt%) is sintered... View More

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