IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of Multiple Reworks on the Accelerated Thermal Cycling and Shock Performance of Lead-Free BGA Assemblies

Author(s): Hongtao Ma ; Weidong Xie ; G. Subbarayan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 November 2012
Volume: 2
Page Count: 8
Page(s): 1,824 - 1,831
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2207722
Regular:

In this paper, the effect of multiple rework cycles (up to 5×) on reliability of lead-free assemblies is investigated. The test vehicle is designed to capture the reliability impact of rework... View More

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