IEEE - Institute of Electrical and Electronics Engineers, Inc. - Sintering of Copper Particles for Die Attach

Author(s): J. Kahler ; N. Heuck ; A. Wagner ; A. Stranz ; E. Peiner ; A. Waag
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2012
Volume: 2
Page Count: 5
Page(s): 1,587 - 1,591
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2201940
Regular:

First steps are taken toward a low-cost alternative to silver sintering as a highly reliable die attach technology for deep drilling applications and future power electronic modules. In this... View More

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