IEEE - Institute of Electrical and Electronics Engineers, Inc. - Hotspot Detection by Improved Adaptive Finite Element Method and its Application in High-Speed PCB and IC Package Design

Author(s): Zhanghong Tang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 October 2012
Volume: 2
Page Count: 7
Page(s): 1,659 - 1,665
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2193146
Regular:

Thermal control of printed circuit board and integrated circuit package is challenging in microelectronics because the power density increases when smaller and more complicated packages are... View More

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