IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Capillary Trace on Dynamic Loop Profile Evolution in Thermosonic Wire Bonding

Author(s): Fuliang Wang ; Yun Chen ; Lei Han
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 September 2012
Volume: 2
Page Count: 8
Page(s): 1,550 - 1,557
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2206593
Regular:

Thermosonic wire bonding remains the most commonly used interconnection technology in microelectronic packaging, and looping is an important aspect in modern wire bonders. To identify the loop... View More

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