IEEE - Institute of Electrical and Electronics Engineers, Inc. - Visualization of Fluid/Structure Interaction in IC Encapsulation

Author(s): Chu Yee Khor ; Mohd Zulkifly Abdullah ; Wei Chiat Leong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2012
Volume: 2
Page Count: 8
Page(s): 1,239 - 1,246
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2199117
Regular:

This paper presents the visualization of the fluid/structure interaction (FSI) in molded integrated-circuit (IC) packaging. The complexity and high cost of the experimental setup in the molded... View More

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