IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal and Mechanical Considerations for Silicon-Resin High-Density Substrate

Author(s): B. Smith ; P. Kwok ; J. Thompson ; A. Mueller ; L. Racz
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2012
Volume: 2
Page Count: 7
Page(s): 1,092 - 1,098
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2198645
Regular:

We examine the thermomechanical tradeoffs in a novel technology for high-density interconnect substrates. Fabricated from silicon (Si) wafers with planar cavities of highly filled composite... View More

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