IEEE - Institute of Electrical and Electronics Engineers, Inc. - A Closed-Form Multiscale Thermal Contact Resistance Model

Author(s): R. L. Jackson ; H. Ghaednia ; Y. A. Elkady ; S. H. Bhavnani ; R. W. Knight
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2012
Volume: 2
Page Count: 14
Page(s): 1,158 - 1,171
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2193584
Regular:

All surfaces are rough to some extent and therefore only a small portion of surfaces actually comes into contact when they are brought together. Therefore heat flow from one object to another is... View More

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