IEEE - Institute of Electrical and Electronics Engineers, Inc. - Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications

Author(s): Jonghyun Kim ; Il Kim ; Yongwon Choi ; Kyung-Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 July 2012
Volume: 2
Page Count: 10
Page(s): 1,118 - 1,127
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2178242
Regular:

In this paper, various photo-patternable polymer adhesive materials were investigated for the selective wafer bonding of microelectromechanical system (MEMS) motion sensors. Commercially... View More

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