IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of Piezoresistive Stress Sensor in Wafer Bumping and Drop Impact Test of Embedded Ultrathin Device

Author(s): Xiaowu Zhang ; R. Rajoo ; C. S. Selvanayagam ; A. Kumar ; V. S. Rao ; N. Khan ; V. Kripesh ; J. H. Lau ; Dim-Lee Kwong ; V. Sundaram ; R. R. Tummala
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2012
Volume: 2
Page Count: 9
Page(s): 935 - 943
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2192731
Regular:

Though an understanding on the development of residual stresses in silicon device after chip level packaging processes has been investigated in previous studies, little is known about the... View More

Advertisement