IEEE - Institute of Electrical and Electronics Engineers, Inc. - Embedded Module for 3-D Mechanical Strain Measurement

Author(s): L. Moore ; J. Barrett
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2012
Volume: 2
Page Count: 10
Page(s): 1,002 - 1,011
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2186962
Regular:

This paper presents the development and evaluation of a miniature (1 cm3) embedded electronic module that can resolve temperature-compensated mechanical strain in three... View More

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