IEEE - Institute of Electrical and Electronics Engineers, Inc. - 40 $\mu{\rm m}$ Flip-Chip Process Using Ag–In Transient Liquid Phase Reaction

Author(s): W. P. Lin ; Chu-Hsuan Sha ; C. C. Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2012
Volume: 2
Page Count: 6
Page(s): 903 - 908
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2186572
Regular:

A flip-chip interconnect process at 180°C using the silver-indium (Ag-In) binary system is reported. An array of 50 × 50 flip-chip joints with 100 μm pitch and 40 μm joint... View More

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