IEEE - Institute of Electrical and Electronics Engineers, Inc. - Hybrid Liquid Immersion and Synthetic Jet Heat Sink for Cooling 3-D Stacked Electronics

Author(s): K. Kota ; P. Hidalgo ; Y. Joshi ; A. Glezer
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2012
Volume: 2
Page Count: 8
Page(s): 817 - 824
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2186452
Regular:

This paper focuses on the design and parametric numerical study of a hybrid heat sink combining a liquid thermal interface with an array of synthetic jet actuators for 3-D chip stack cooling. The... View More

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