IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrasonic Bonding of Anisotropic Conductive Films Containing Ultrafine Solder Balls for High-Power and High-Reliability Flex-On-Board Assembly

Author(s): Won-Chul Kim ; Kiwon Lee ; I. J. Saarinen ; L. Pykari ; Kyung-Wook Paik
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2012
Volume: 2
Page Count: 6
Page(s): 884 - 889
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2179043
Regular:

New solder anisotropic conductive films (ACFs) consist of a thermosetting polymer resin and fine solder balls instead of the conventional metal particles or metal-coated polymer particles. These... View More

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