IEEE - Institute of Electrical and Electronics Engineers, Inc. - Encapsulation of Microelectronic Components Using Open-Ended Microwave Oven

Author(s): Sumanth Kumar Pavuluri ; Marju Ferenets ; George Goussetis ; Marc P. Y. Desmulliez ; Tim Tilford ; Raphael Adamietz ; Guido Mueller ; Frank Eicher ; Chris Bailey
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 May 2012
Volume: 2
Page(s): 799 - 806
ISSN (Electronic): 2156-3985
ISSN (Paper): 2156-3950
DOI: 10.1109/TCPMT.2011.2177524
Regular:

An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing... View More

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