IEEE - Institute of Electrical and Electronics Engineers, Inc. - Return-Path Extraction Technique for SSO Analysis of Low-Cost Wire-Bonding BGA Packages

Author(s): R. Oikawa ; D. Gope ; V. Jandhyala
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 April 2012
Volume: 2
Page Count: 10
Page(s): 677 - 686
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2012.2187015
Regular:

A return-path decomposition method that eliminates artificial return-path discontinuities is presented. The methodology is applied to over 2 Gb/s simultaneous switching output analysis of a... View More

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