IEEE - Institute of Electrical and Electronics Engineers, Inc. - Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz

Author(s): Li-Han Hsu ; Chee-Way Oh ; Wei-Cheng Wu ; E. Y. Chang ; H. Zirath ; Chin-Te Wang ; Szu-Ping Tsai ; Wee-Chin Lim ; Yueh-Chin Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 March 2012
Volume: 2
Page Count: 8
Page(s): 402 - 409
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2171485
Regular:

This paper presents a flip-chip-on-board (FCOB) packaging technology using a Rogers RO3210 laminate for microwave applications. Compared to the conventional microwave packaging architecture, the... View More

Advertisement