IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of Lamination Theory to Study Warpage Across PWB and PWBA During Convective Reflow Process

Author(s): Wei Tan ; I. C. Ume
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 February 2012
Volume: 2
Page Count: 7
Page(s): 217 - 223
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2174793
Regular:

Out-of-plane displacement (warpage) has been a major reliability concern for board-level electronic packaging. Printed wiring board (PWB) and component warpage results principally from coefficient... View More

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