IEEE - Institute of Electrical and Electronics Engineers, Inc. - Improving conduction and mechanical reliability of woven metal interconnects

Author(s): R. Bhattacharya ; L. van Pieterson ; K. van Os
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2012
Volume: 2
Page Count: 4
Page(s): 165 - 168
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2171041
Regular:

We present a simple fabrication process that produces reliable electronic textile backplanes. We electroplate copper onto woven conductive yarns in order to improve the yarn's conductivity as well... View More

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