IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reduction of Thermal Resistance of High-Power Amplifiers by Carbon Fiber-Reinforced Carbon Composite-Based Package

Author(s): N. Kuroda ; A. Wakejima ; M. Tanomura ; K. Ota ; Y. Ando ; T. Nakayama ; Y. Okamoto ; K. Matsunaga ; H. Miyamoto
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2012
Volume: 2
Page Count: 7
Page(s): 95 - 101
ISSN (Paper): 2156-3950
ISSN (Online): 2156-3985
DOI: 10.1109/TCPMT.2011.2169673
Regular:

This paper deals with the thermal design of an electronics package and a demonstration of reduced thermal resistance for high-power amplifiers (HPAs). The focus is package internal thermal... View More

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