IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ultrafine Pitch (6 $\mu\hbox{m}$ ) of Recessed and Bonded Cu–Cu Interconnects by Three-Dimensional Wafer Stacking

Author(s): Lan Peng ; Lin Zhang ; Ji Fan ; Hong Yu Li ; Dau Fatt Lim ; Chuan Seng Tan
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 December 2012
Volume: 33
Page Count: 3
Page(s): 1,747 - 1,749
ISSN (Paper): 0741-3106
ISSN (Online): 1558-0563
DOI: 10.1109/LED.2012.2218273
Regular:

In this letter, an evolution of high-density (>; 106 cm-2) bonded Cu-Cu interconnects of 6-μm pitch is successfully demonstrated using wafer-on-wafer thermocompression bonding.... View More

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