IEEE - Institute of Electrical and Electronics Engineers, Inc. - Redistribution of Electrical Interconnections for Three-Dimensional Wafer-Level Packaging With Silicon Bumps

Author(s): Guoqiang Wu ; Dehui Xu ; Bin Xiong ; Yuelin Wang
Sponsor(s): IEEE Electron Devices Society
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 August 2012
Volume: 33
Page Count: 3
Page(s): 1,177 - 1,179
ISSN (Paper): 0741-3106
ISSN (Online): 1558-0563
DOI: 10.1109/LED.2012.2200231
Regular:

In this letter, an approach to the redistribution of electrical interconnections is investigated for potential application in 3-D wafer-level packaging. A cap wafer with silicon bumps and... View More

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